Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements

Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand. Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements. IBM Journal of Research and Development, 49(4-5):777-803, 2005. [doi]

@article{LanzerottiFR05:0,
  title = {Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements},
  author = {Mary Yvonne Lanzerotti and Giovanni Fiorenza and Rick A. Rand},
  year = {2005},
  doi = {10.1147/rd.494.0777},
  url = {http://dx.doi.org/10.1147/rd.494.0777},
  tags = {e-science},
  researchr = {https://researchr.org/publication/LanzerottiFR05%3A0},
  cites = {0},
  citedby = {0},
  journal = {IBM Journal of Research and Development},
  volume = {49},
  number = {4-5},
  pages = {777-803},
}