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Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration

Bastian Latsch, Omar Ben Dali, Romol Chadda, Niklas Schäfer, Alexander A. Altmann, Martin Grimmer 0001, Philipp Beckerle, Mario Kupnik. Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023. pages 1-4, IEEE, 2023. [doi]

Authors

Bastian Latsch

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Omar Ben Dali

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Romol Chadda

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Niklas Schäfer

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Alexander A. Altmann

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Martin Grimmer 0001

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Philipp Beckerle

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Mario Kupnik

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