Bastian Latsch, Omar Ben Dali, Romol Chadda, Niklas Schäfer, Alexander A. Altmann, Martin Grimmer 0001, Philipp Beckerle, Mario Kupnik. Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{LatschDCSAGBK23,
title = {Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration},
author = {Bastian Latsch and Omar Ben Dali and Romol Chadda and Niklas Schäfer and Alexander A. Altmann and Martin Grimmer 0001 and Philipp Beckerle and Mario Kupnik},
year = {2023},
doi = {10.1109/SENSORS56945.2023.10325114},
url = {https://doi.org/10.1109/SENSORS56945.2023.10325114},
researchr = {https://researchr.org/publication/LatschDCSAGBK23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
publisher = {IEEE},
isbn = {979-8-3503-0387-2},
}