Brian Lee. Review of 3D high density storage class memory (SCM) architecture. In Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012. pages 1, IEEE, 2012. [doi]
@inproceedings{Lee12-93,
title = {Review of 3D high density storage class memory (SCM) architecture},
author = {Brian Lee},
year = {2012},
doi = {10.1109/VLSI-DAT.2012.6212611},
url = {http://dx.doi.org/10.1109/VLSI-DAT.2012.6212611},
researchr = {https://researchr.org/publication/Lee12-93},
cites = {0},
citedby = {0},
pages = {1},
booktitle = {Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012},
publisher = {IEEE},
isbn = {978-1-4577-2080-2},
}