Ren-Jie Lee, Hung-Ming Chen. Efficient Package Pin-Out Planning With System Interconnects Optimization for Package-Board Codesign. IEEE Trans. VLSI Syst., 19(5):904-909, 2011. [doi]
@article{LeeC11-10, title = {Efficient Package Pin-Out Planning With System Interconnects Optimization for Package-Board Codesign}, author = {Ren-Jie Lee and Hung-Ming Chen}, year = {2011}, doi = {10.1109/TVLSI.2010.2041562}, url = {http://dx.doi.org/10.1109/TVLSI.2010.2041562}, tags = {optimization}, researchr = {https://researchr.org/publication/LeeC11-10}, cites = {0}, citedby = {0}, journal = {IEEE Trans. VLSI Syst.}, volume = {19}, number = {5}, pages = {904-909}, }