Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba. Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{LeeCLIKCO19,
title = {Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias},
author = {Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Hiroyuki Ito and Young-Suk Kim and Kuan-Neng Chen and Takayuki Ohba},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058776},
url = {https://doi.org/10.1109/3DIC48104.2019.9058776},
researchr = {https://researchr.org/publication/LeeCLIKCO19},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}