DongJin Lee, Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty. Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip. ACM Trans. Design Autom. Electr. Syst., 23(5), 2018. [doi]
@article{LeeDDPC18,
title = {Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip},
author = {DongJin Lee and Sourav Das and Janardhan Rao Doppa and Partha Pratim Pande and Krishnendu Chakrabarty},
year = {2018},
doi = {10.1145/3223046},
url = {https://doi.org/10.1145/3223046},
researchr = {https://researchr.org/publication/LeeDDPC18},
cites = {0},
citedby = {0},
journal = {ACM Trans. Design Autom. Electr. Syst.},
volume = {23},
number = {5},
}