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Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip

DongJin Lee, Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty. Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip. ACM Trans. Design Autom. Electr. Syst., 23(5), 2018. [doi]

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