Chin-Wei Lee, Daniel Hládek, Matús Pleva, Yuan-Fu Liao, Ming-Hsiang Su. Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry. In Asia Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2023, Taipei, Taiwan, October 31 - Nov. 3, 2023. pages 2173-2177, IEEE, 2023. [doi]
Abstract is missing.