Mechanical characterization of residual stress around TSV through instrumented indentation algorithm - researchr publication authors

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Gyujei Lee, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon. Mechanical characterization of residual stress around TSV through instrumented indentation algorithm. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]

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