Gyujei Lee, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon. Mechanical characterization of residual stress around TSV through instrumented indentation algorithm. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]
@inproceedings{LeeJBK11,
title = {Mechanical characterization of residual stress around TSV through instrumented indentation algorithm},
author = {Gyujei Lee and Suk-woo Jeon and Kwang-yoo Byun and Dongil Kwon},
year = {2011},
doi = {10.1109/3DIC.2012.6262996},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262996},
researchr = {https://researchr.org/publication/LeeJBK11},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}