Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit

Yeji Lee, Wonyeong Jang, Kyungbae Kwon, Jihun Park, Changhyun Yoo, Jeesoo Chang, Jongwook Jeon. Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit. IEEE Access, 10:80695-80702, 2022. [doi]

@article{LeeJKPYCJ22,
  title = {Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit},
  author = {Yeji Lee and Wonyeong Jang and Kyungbae Kwon and Jihun Park and Changhyun Yoo and Jeesoo Chang and Jongwook Jeon},
  year = {2022},
  doi = {10.1109/ACCESS.2022.3195506},
  url = {https://doi.org/10.1109/ACCESS.2022.3195506},
  researchr = {https://researchr.org/publication/LeeJKPYCJ22},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {10},
  pages = {80695-80702},
}