18.3 A 1.2V 64Gb 8-channel 256GB/s HBM DRAM with peripheral-base-die architecture and small-swing technique on heavy load interface

Jong Chern Lee, Jihwan Kim, Kyung-whan Kim, Young Jun Ku, Dae Suk Kim, Chunseok Jeong, Tae Sik Yun, Hongjung Kim, Ho Sung Cho, Yeon Ok Kim, Jae-Hwan Kim, Jin-Ho Kim, Sangmuk Oh, Hyun Sung Lee, Ki Hun Kwon, Dong Beom Lee, Young Jae Choi, Jeajin Lee, Hyeon Gon Kim, Jun Hyun Chun, Jonghoon Oh, Seok Hee Lee. 18.3 A 1.2V 64Gb 8-channel 256GB/s HBM DRAM with peripheral-base-die architecture and small-swing technique on heavy load interface. In 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016, San Francisco, CA, USA, January 31 - February 4, 2016. pages 318-319, IEEE, 2016. [doi]

Abstract

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