K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tetsu Tanaka. Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{LeeNNABKHFT15,
title = {Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers},
author = {K. W. Lee and C. Nagai and A. Nakamura and H. Aizawa and Ji Chel Bea and Mitsumasa Koyanagi and Hideto Hashiguchi and Takafumi Fukushima and Tetsu Tanaka},
year = {2015},
doi = {10.1109/3DIC.2015.7334471},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334471},
researchr = {https://researchr.org/publication/LeeNNABKHFT15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}