Kang-Wook Lee, Alfred Viehbeck. Wet-process surface modification of dielectric polymers: Adhesion enhancement and metallization. IBM Journal of Research and Development, 38(4):457-474, 1994.
@article{LeeV94,
title = {Wet-process surface modification of dielectric polymers: Adhesion enhancement and metallization},
author = {Kang-Wook Lee and Alfred Viehbeck},
year = {1994},
researchr = {https://researchr.org/publication/LeeV94},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {38},
number = {4},
pages = {457-474},
}