An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach

R. W. K. Leung, Henry C. W. Lau, C. K. Kwong. An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach. Artif. Intell. Rev., 21(2):139-159, 2004. [doi]

@article{LeungLK04,
  title = {An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach},
  author = {R. W. K. Leung and Henry C. W. Lau and C. K. Kwong},
  year = {2004},
  doi = {10.1023/B:AIRE.0000020937.82267.32},
  url = {http://dx.doi.org/10.1023/B:AIRE.0000020937.82267.32},
  tags = {process monitoring, C++, logic, systematic-approach},
  researchr = {https://researchr.org/publication/LeungLK04},
  cites = {0},
  citedby = {0},
  journal = {Artif. Intell. Rev.},
  volume = {21},
  number = {2},
  pages = {139-159},
}