Lei Li, Kangfa Deng, Wen Xia, Ningli Zhu, Song Li, Weiguo Su, Wei Zhang. A convenient wafer level bonding based on unpatterned BCB. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014. pages 502-506, IEEE, 2014. [doi]
@inproceedings{LiDXZLSZ14,
title = {A convenient wafer level bonding based on unpatterned BCB},
author = {Lei Li and Kangfa Deng and Wen Xia and Ningli Zhu and Song Li and Weiguo Su and Wei Zhang},
year = {2014},
doi = {10.1109/NEMS.2014.6908859},
url = {https://doi.org/10.1109/NEMS.2014.6908859},
researchr = {https://researchr.org/publication/LiDXZLSZ14},
cites = {0},
citedby = {0},
pages = {502-506},
booktitle = {9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014},
publisher = {IEEE},
isbn = {978-1-4799-4726-3},
}