Lei Li, Kangfa Deng, Wen Xia, Ningli Zhu, Song Li, Weiguo Su, Wei Zhang. A convenient wafer level bonding based on unpatterned BCB. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014. pages 502-506, IEEE, 2014. [doi]
Abstract is missing.