Failure analysis of a thin-film nitride MEMS package

Q. Li, J. F. L. Goosen, J. T. M. van Beek, F. van Keulen, K. L. Phan, G. Q. Zhang. Failure analysis of a thin-film nitride MEMS package. Microelectronics Reliability, 48(8-9):1557-1561, 2008. [doi]

Abstract

Abstract is missing.