Xiangfeng Li, Lili Qu, Bo Zhang, Hui Liao, Zonghua Zhang. An improved multi-level converter with a novel sub-module circuit. In IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29 - November 1, 2017. pages 4863-4866, IEEE, 2017. [doi]
Abstract is missing.