Process improvement of 0.13mum Cu/Low K (Black Diamond:::TM:::) dual damascene interconnection - researchr publication authors

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H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang. Process improvement of 0.13mum Cu/Low K (Black Diamond:::TM:::) dual damascene interconnection. Microelectronics Reliability, 45(7-8):1134-1143, 2005. [doi]

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