H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang. Process improvement of 0.13mum Cu/Low K (Black Diamond:::TM:::) dual damascene interconnection. Microelectronics Reliability, 45(7-8):1134-1143, 2005. [doi]
@article{LiSTSBZ05,
title = {Process improvement of 0.13mum Cu/Low K (Black Diamond:::TM:::) dual damascene interconnection},
author = {H. Y. Li and Y. J. Su and C. F. Tsang and S. M. Sohan and V. N. Bliznetsov and L. Zhang},
year = {2005},
doi = {10.1016/j.microrel.2004.11.057},
url = {http://dx.doi.org/10.1016/j.microrel.2004.11.057},
tags = {C++},
researchr = {https://researchr.org/publication/LiSTSBZ05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {7-8},
pages = {1134-1143},
}