Low temperature Si/Si wafer direct bonding using a plasma activated method

Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen. Low temperature Si/Si wafer direct bonding using a plasma activated method. Journal of Zhejiang University - Science C, 14(4):244-251, 2013. [doi]

Abstract

Abstract is missing.