Junhui Li, Qing Tian, Haoliang Zhang, Xinxin Chen, Xiaohe Liu, Wenhui Zhu. Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging. IEEE Trans. Industrial Informatics, 14(11):4746-4754, 2018. [doi]
Abstract is missing.