Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System - researchr publication authors

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Jiedong Li, Hui Tang 0003, Zhongyuan Zhu, Sifeng He, Jian Gao 0002, Yunbo He, Xin Chen 0005. Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System. IEEE Transactions on Industrial Electronics, 69(9):9235-9245, 2022. [doi]

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