Jiedong Li, Hui Tang 0003, Zhongyuan Zhu, Sifeng He, Jian Gao 0002, Yunbo He, Xin Chen 0005. Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System. IEEE Transactions on Industrial Electronics, 69(9):9235-9245, 2022. [doi]
Abstract is missing.