The influence of device morphology on wafer-level bonding with polymer-coated layer - researchr publication authors

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Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen. The influence of device morphology on wafer-level bonding with polymer-coated layer. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]

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