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Using RBF networks for detection and prediction of flip chip with missing bumps

Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi. Using RBF networks for detection and prediction of flip chip with missing bumps. Microelectronics Reliability, 55(12):2817-2825, 2015. [doi]

Authors

Guanglan Liao

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Li Du

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Lei Su

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Miao Zeng

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Lei Nie

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Tielin Shi

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