Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi. Using RBF networks for detection and prediction of flip chip with missing bumps. Microelectronics Reliability, 55(12):2817-2825, 2015. [doi]
@article{LiaoDSZNS15,
title = {Using RBF networks for detection and prediction of flip chip with missing bumps},
author = {Guanglan Liao and Li Du and Lei Su and Miao Zeng and Lei Nie and Tielin Shi},
year = {2015},
doi = {10.1016/j.microrel.2015.09.030},
url = {http://dx.doi.org/10.1016/j.microrel.2015.09.030},
researchr = {https://researchr.org/publication/LiaoDSZNS15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {12},
pages = {2817-2825},
}