A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration - researchr publication authors

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Jie Liao, Bo Jiao, Jinshan Zhang 0006, Shiwei Liu, Hao Jiang, Jun Tao, Wenning Jiang, Qi Liu, Lihua Zhang, Haozhe Zhu, Chixiao Chen. A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration. In IEEE International Symposium on Circuits and Systems, ISCAS 2023, Monterey, CA, USA, May 21-25, 2023. pages 1-5, IEEE, 2023. [doi]

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