Jie Liao, Bo Jiao, Jinshan Zhang 0006, Shiwei Liu, Hao Jiang, Jun Tao, Wenning Jiang, Qi Liu, Lihua Zhang, Haozhe Zhu, Chixiao Chen. A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration. In IEEE International Symposium on Circuits and Systems, ISCAS 2023, Monterey, CA, USA, May 21-25, 2023. pages 1-5, IEEE, 2023. [doi]
@inproceedings{LiaoJ0LJTJLZZC23,
title = {A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration},
author = {Jie Liao and Bo Jiao and Jinshan Zhang 0006 and Shiwei Liu and Hao Jiang and Jun Tao and Wenning Jiang and Qi Liu and Lihua Zhang and Haozhe Zhu and Chixiao Chen},
year = {2023},
doi = {10.1109/ISCAS46773.2023.10181990},
url = {https://doi.org/10.1109/ISCAS46773.2023.10181990},
researchr = {https://researchr.org/publication/LiaoJ0LJTJLZZC23},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2023, Monterey, CA, USA, May 21-25, 2023},
publisher = {IEEE},
isbn = {978-1-6654-5109-3},
}