Wei-Hsun Liao, Chang-Tzu Lin, Sheng-Hsin Fang, Chien-Chia Huang, Hung-Ming Chen, Ding-Ming Kwai, Yung-Fa Chou. Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 549-553, IEEE, 2017. [doi]
@inproceedings{LiaoLFHCKC17,
title = {Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization},
author = {Wei-Hsun Liao and Chang-Tzu Lin and Sheng-Hsin Fang and Chien-Chia Huang and Hung-Ming Chen and Ding-Ming Kwai and Yung-Fa Chou},
year = {2017},
doi = {10.1109/ASPDAC.2017.7858381},
url = {http://dx.doi.org/10.1109/ASPDAC.2017.7858381},
researchr = {https://researchr.org/publication/LiaoLFHCKC17},
cites = {0},
citedby = {0},
pages = {549-553},
booktitle = {22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017},
publisher = {IEEE},
isbn = {978-1-5090-1558-0},
}