Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Lois Jinzhi Liao, Xi Zhang, Xiaomin Li, Younan Hua, Chao Fu, Weikok Tee, Boonhwa Yee, Bisheng Wang, Songlin Mao. Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination. In International Conference on IC Design and Technology, ICICDT 2019, Suzhou, China, June 17-19, 2019. pages 1-6, IEEE, 2019. [doi]

This author has not been identified. Look up 'Lois Jinzhi Liao' in GoogleThis author has not been identified. Look up 'Xi Zhang' in GoogleThis author has not been identified. Look up 'Xiaomin Li' in GoogleThis author has not been identified. Look up 'Younan Hua' in GoogleThis author has not been identified. Look up 'Chao Fu' in GoogleThis author has not been identified. Look up 'Weikok Tee' in GoogleThis author has not been identified. Look up 'Boonhwa Yee' in GoogleThis author has not been identified. Look up 'Bisheng Wang' in GoogleThis author has not been identified. Look up 'Songlin Mao' in Google

runs on WebDSL