Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

J. B. Libot, Joël Alexis, Olivier Dalverny, L. Arnaud, P. Milesi, F. Dulondel. Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectronics Reliability, 83:64-76, 2018. [doi]

Abstract

Abstract is missing.