Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder

Kart Leong Lim, Rahul Dutta. Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder. In International IEEE Conference on Prognostics and Health Management, ICPHM 2021, Detroit, MI, USA, June 7-9, 2021. pages 1-8, IEEE, 2021. [doi]

@inproceedings{LimD21-1,
  title = {Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder},
  author = {Kart Leong Lim and Rahul Dutta},
  year = {2021},
  doi = {10.1109/ICPHM51084.2021.9486471},
  url = {https://doi.org/10.1109/ICPHM51084.2021.9486471},
  researchr = {https://researchr.org/publication/LimD21-1},
  cites = {0},
  citedby = {0},
  pages = {1-8},
  booktitle = {International IEEE Conference on Prognostics and Health Management, ICPHM 2021, Detroit, MI, USA, June 7-9, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-1970-3},
}