Martin Ying Song Lim, Anurag Sharma, Cheng Siong Chin, Chun Ming Tommy Yip, Jonathan Yoong Seang Ong. Prediction of Wafer Map Categories Using Wafer Acceptance Test Parameters in Semiconductor Manufacturing. In Ilias Maglogiannis, Lazaros Iliadis, John MacIntyre, Paulo Cortez 0001, editors, Artificial Intelligence Applications and Innovations - 18th IFIP WG 12.5 International Conference, AIAI 2022, Hersonissos, Crete, Greece, June 17-20, 2022, Proceedings, Part II. Volume 647 of IFIP Advances in Information and Communication Technology, pages 136-144, Springer, 2022. [doi]
Abstract is missing.