Clara Y. O. Lin, Joseph P. Curilla. Temperature-related changes in dielectric constant and dissipation factor of insulations increase attenuation in data cables used in building plenums. In Proceedings of the 16th Conference on Local Computer Networks, LCN 1991, October 14-17, 1991, Minneapolis, Minnesota, USA. pages 74-79, IEEE, 1991. [doi]
Abstract is missing.