The study of compensative structure assisted convex and concave corner structures etching by inductively coupled plasma-reactive ion etch (ICP-RIE) - researchr publication authors

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Yu-Hsin Lin, Yuan-Chieh Cheng, Nien-Nan Chu, Wensyang Hsu, Yu-Hsiang Tang, Po-Li Chen, Chih-Chung Yang, Ming-Hua Hsiao, Chien-Nan Hsiao. The study of compensative structure assisted convex and concave corner structures etching by inductively coupled plasma-reactive ion etch (ICP-RIE). In 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7-11, 2015. pages 491-493, IEEE, 2015. [doi]

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