Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng-Chen Lin, Liann-Be Chang, Ming-Jer Jeng, Chia-Yi Yen, Atanu Das, Chung Yi Tang, Ming-Yi Tsai, Mu-Jen Lai. Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps. Microelectronics Reliability, 50(5):683-687, 2010. [doi]

Abstract

Abstract is missing.