A Digital Signature Virtual Platform based on Hardware-Software Co-Design

Fengjie Lin, Shuting Cai, Heming Liu. A Digital Signature Virtual Platform based on Hardware-Software Co-Design. In HP3C 2022: 6th International Conference on High Performance Compilation, Computing and Communications, Virtual Event, China, June 23 - 25, 2022. pages 106-110, ACM, 2021. [doi]

Authors

Fengjie Lin

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Shuting Cai

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Heming Liu

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