Fengjie Lin, Shuting Cai, Heming Liu. A Digital Signature Virtual Platform based on Hardware-Software Co-Design. In HP3C 2022: 6th International Conference on High Performance Compilation, Computing and Communications, Virtual Event, China, June 23 - 25, 2022. pages 106-110, ACM, 2021. [doi]
@inproceedings{LinCL21-4,
title = {A Digital Signature Virtual Platform based on Hardware-Software Co-Design},
author = {Fengjie Lin and Shuting Cai and Heming Liu},
year = {2021},
doi = {10.1145/3546000.3546016},
url = {https://doi.org/10.1145/3546000.3546016},
researchr = {https://researchr.org/publication/LinCL21-4},
cites = {0},
citedby = {0},
pages = {106-110},
booktitle = {HP3C 2022: 6th International Conference on High Performance Compilation, Computing and Communications, Virtual Event, China, June 23 - 25, 2022},
publisher = {ACM},
isbn = {978-1-4503-9629-5},
}