Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test - researchr publication authors

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Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh. Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test. Microelectronics Reliability, 55(1):231-237, 2015. [doi]

This author has not been identified. Look up 'Hsiu-Min Lin' in GoogleThis author has not been identified. Look up 'Cheng-Ying Ho' in GoogleThis author has not been identified. Look up 'Wen-Lin Chen' in GoogleThis author has not been identified. Look up 'Yi-Hsin Wu' in GoogleThis author has not been identified. Look up 'De-Hui Wang' in GoogleThis author has not been identified. Look up 'Jun-Ren Lin' in GoogleThis author has not been identified. Look up 'Yu Hui Wu' in GoogleThis author has not been identified. Look up 'Huei-Cheng Hong' in GoogleThis author has not been identified. Look up 'Zhi-Wei Lin' in GoogleThis author has not been identified. Look up 'Jenq-Gong Duh' in Google

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