Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh. Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test. Microelectronics Reliability, 55(1):231-237, 2015. [doi]
Abstract is missing.