Power noise suppression technique using active decoupling capacitor for TSV 3D integration - researchr publication authors

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Tien-Hung Lin, Po-Tsang Huang, Wei Hwang. Power noise suppression technique using active decoupling capacitor for TSV 3D integration. In Thomas Büchner, Ramalingam Sridhar, Andrew Marshall, Norbert Schuhmann, editors, Annual IEEE International SoC Conference, SoCC 2010, September 27-29, 2010, Las Vegas, NV, USA, Proceedings. pages 209-212, IEEE, 2010. [doi]

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