Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Tien-Hung Lin, Po-Tsang Huang, Wei Hwang. Power noise suppression technique using active decoupling capacitor for TSV 3D integration. In Thomas B├╝chner, Ramalingam Sridhar, Andrew Marshall, Norbert Schuhmann, editors, Annual IEEE International SoC Conference, SoCC 2010, September 27-29, 2010, Las Vegas, NV, USA, Proceedings. pages 209-212, IEEE, 2010. [doi]

Abstract

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