Kuo-Yi Lin, Chia-Yu Hsu, Hui-Chun Yu. A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing. Int. J. Computational Intelligence Systems, 7(sup2):66-73, 2014. [doi]
@article{LinHY14,
title = {A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing},
author = {Kuo-Yi Lin and Chia-Yu Hsu and Hui-Chun Yu},
year = {2014},
doi = {10.1080/18756891.2014.947116},
url = {http://dx.doi.org/10.1080/18756891.2014.947116},
researchr = {https://researchr.org/publication/LinHY14},
cites = {0},
citedby = {0},
journal = {Int. J. Computational Intelligence Systems},
volume = {7},
number = {sup2},
pages = {66-73},
}