Yun-Wei Lin, Chia-Ming Lin. Optimization of the Deposition Condition for Improving the Ti Film Resistance of DRAM Products. In Yi-Bing Lin, Der-Jiunn Deng, editors, Smart Grid and Internet of Things - 4th EAI International Conference, SGIoT 2020, TaiChung, Taiwan, December 5-6, 2020, Proceedings. Volume 354 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, pages 527-542, Springer, 2020. [doi]
Abstract is missing.