The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai. The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability, 42(3):375-380, 2002. [doi]

Abstract

Abstract is missing.