Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Nay Lin, Jianmin Miao, Pradeep Dixit. Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation. Microelectronics Reliability, 53(12):1943-1953, 2013. [doi]

Authors

Nay Lin

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Jianmin Miao

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Pradeep Dixit

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