Nay Lin, Jianmin Miao, Pradeep Dixit. Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation. Microelectronics Reliability, 53(12):1943-1953, 2013. [doi]
@article{LinMD13,
title = {Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation},
author = {Nay Lin and Jianmin Miao and Pradeep Dixit},
year = {2013},
doi = {10.1016/j.microrel.2013.04.003},
url = {http://dx.doi.org/10.1016/j.microrel.2013.04.003},
researchr = {https://researchr.org/publication/LinMD13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {12},
pages = {1943-1953},
}